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5748676-3

5748676-3

5748676-3

TE Connectivity AMP Connectors

CONN BACKSHELL 25POS 180DEG SHLD

SOT-23

5748676-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Contact PlatingCopper
Package / Case Metal
Material Metal, Zinc Alloy
Housing Material CuSn
Published 1998
Series AMPLIMITE HD-20
Feature Mating Screws 4-40
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Connector
Number of Positions 25
Color Silver
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Orientation Straight
Shielding Shielded
Depth 17.27mm
ELV Compliant
Plating Nickel over Copper
Cable TypeRound
Accessory Type Two Piece Backshell
Wire/Cable Diameter 11.94 mm
Cable Exit 180°
Cable Entry-Max 0.47 inch
Hardware Assembly Hardware, Grommets
Height 17.27mm
Length 53.08mm
REACH SVHC Yes
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:524 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$6.98000$6.98
10$6.67600$66.76
25$6.06960$151.74
50$5.76600$288.3
100$5.61420$561.42
250$5.00728$1251.82
500$4.70380$2351.9

About 5748676-3

The 5748676-3 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BACKSHELL 25POS 180DEG SHLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5748676-3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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