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5745833-1

5745833-1

5745833-1

TE Connectivity AMP Connectors

CONN BACKSHELL 25POS 180DEG SHLD

SOT-23

5745833-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Lifecycle Status ACTIVE (Last Updated: 5 months ago)
Mount Cable
Package / Case Metal
Number of Pins 25
Shell Material Thermoplastic
Material Thermoplastic
Housing Material Plastic
Published 2006
Series AMPLIMITE
Feature Mating Screws 4-40
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Connector
Number of Positions 25
Color Silver
Orientation Straight
Shielding Shielded
Depth 48.76mm
Shell Finish Nickel
Number of Contacts 25
ELV Compliant
Plating Nickel over Copper
Cable TypeRound
Wire/Cable Type Round
Accessory Type Two Piece Backshell
Wire/Cable Diameter 13.462 mm
Cable Exit 180°
Hardware Assembly Hardware
Height 17.27mm
Length 53.08mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:474 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$16.479600$16.4796
10$15.546792$155.46792
100$14.666785$1466.6785
500$13.836590$6918.295
1000$13.053387$13053.387

About 5745833-1

The 5745833-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BACKSHELL 25POS 180DEG SHLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5745833-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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