Welcome to Hotenda.com Online Store!

logo
userjoin
Home

5745171-2

5745171-2

5745171-2

TE Connectivity AMP Connectors

CONN BACKSHELL 9POS 180DEG SHLD

SOT-23

5745171-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Lifecycle Status ACTIVE (Last Updated: 5 months ago)
Package / Case Metal
Material Metal, Zinc Alloy
Published 2006
Series AMPLIMITE
Feature Mating Screws 4-40
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type Connector
Number of Positions 9
Color Silver
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Orientation Straight
Shielding Shielded
Depth 48.51mm
Plating Nickel over Copper
Cable TypeRound
Accessory Type Two Piece Backshell
Wire/Cable Diameter 5.08 mm
Cable Exit 180°
Cable Entry-Max 0.53 inch
Hardware Assembly Hardware, Strain Relief
Height 15.74mm
Length 30.86mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:616 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$12.662600$12.6626
10$11.945848$119.45848
100$11.269668$1126.9668
500$10.631762$5315.881
1000$10.029965$10029.965

About 5745171-2

The 5745171-2 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BACKSHELL 9POS 180DEG SHLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5745171-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

Get Subscriber

Enter Your Email Address, Get the Latest News