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5745171-1

5745171-1

5745171-1

TE Connectivity AMP Connectors

CONN BACKSHELL 9POS 180DEG SHLD

SOT-23

5745171-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Mount Cable
Package / Case Metal
Material Metal, Zinc Alloy
Published 2006
Series AMPLIMITE
Feature Mating Screws 4-40
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type Connector
Number of Positions 9
Color Silver
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Orientation Straight
Shielding Shielded
Depth 48.51mm
Shell Finish Nickel
ELV Compliant
Plating Nickel over Copper
Cable TypeRound
Accessory Type Two Piece Backshell
Wire/Cable Diameter 6.35 mm
Cable Exit 180°
Cable Entry-Max 0.53 inch
Hardware Assembly Hardware, Strain Relief
Height 15.74mm
Length 30.86mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:574 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$11.10000$11.1
10$10.08700$100.87
25$9.83480$245.87
50$9.07840$453.92
100$8.57400$857.4
250$7.81744$1954.36
500$7.31308$3656.54

About 5745171-1

The 5745171-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BACKSHELL 9POS 180DEG SHLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5745171-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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