5533444-3 Overview
Currently, it is packaged in Header, Male Pins.Mounting type Through Hole, Right Angle is selected for the device.It has been determined that a Tube case is necessary to package the product.It is part of the HDI (High Density Interconnect) Series of products.A number of features make it more powerful because of its Mating Guide feature.Through Hole is used to mount the part.Device runs at -65°C~125°C Operating Temperature.
5533444-3 Features
HDI (High Density Interconnect) series
5533444-3 Applications
There are a lot of TE Connectivity AMP Connectors 5533444-3 Backplane Connectors applications.
- Embedded systems
- Electrical substations
- Automotive Electronics
- Data Technology
- Medical technology
- Instrumentation
- Anywhere power is distributed
- Industrial Automation
- Control panels
- Blowers
