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5179759-1

5179759-1

5179759-1

TE Connectivity AMP Connectors

IC & Component Sockets M-3 SOCKET ASSY 72P V DIP TYPE

SOT-23

5179759-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBronze
Mount Through Hole
Mounting Type Through Hole
Mounting FeatureNormal, Standard - Top
Housing Material Polymer
PackagingTray
Published 2006
Series Mini Memory Module (M3)
Feature Board Guide, Latches
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 72
Number of Rows 2
Voltage - Rated 3.3V
Additional FeaturePOLARIZED
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 1.27mm
Total Number of Contacts 72
Orientation Straight
Depth 5.8mm
Contact Finish Gold
Contact Gender FEMALE
UL Flammability Code 94V-0
Housing Color Natural
Body/Shell Style SOCKET
ELV Compliant
Connector Style DIMM
Memory TypeDRAM
Length 69.25mm
Contact Finish Thickness 11.8μin 0.30μm
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
Flammability Rating UL94 V-0
In-Stock:3853 items

About 5179759-1

The 5179759-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features IC & Component Sockets M-3 SOCKET ASSY 72P V DIP TYPE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5179759-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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