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4-1108757-1

4-1108757-1

4-1108757-1

TE Connectivity AMP Connectors

4-1108757-1 datasheet pdf and Heavy Duty Connectors - Contacts product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

4-1108757-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 24 Weeks
Contact PlatingSilver
Mount Cable
PackagingBulk
Series HSK, HTS
Published 2009
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Connector Type Pin
Type Machined
Gender Male
Orientation Straight
Current Rating40A
Contact Finish Silver
Approval Agency UL
Contact Resistance 3MOhm
Wire Gauge10 AWG
ELV Compliant
Wire/Cable Gauge 8 AWG
Contact Current Rating40A
Contact Termination Crimp
Pin or Socket Pin
VDE Tested Yes
Length 34.8mm
Contact Finish Thickness 78.7μin 2.00μm
RoHS StatusRoHS Compliant
In-Stock:725 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$8.183200$8.1832
10$7.720000$77.2
100$7.283019$728.3019
500$6.870773$3435.3865
1000$6.481861$6481.861

About 4-1108757-1

The 4-1108757-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features 4-1108757-1 datasheet pdf and Heavy Duty Connectors - Contacts product details from TE Connectivity AMP Connectors stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 4-1108757-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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