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350180-9

350180-9

350180-9

TE Connectivity AMP Connectors

Test Probes TEST PROBE ASSEMBLY

SOT-23

350180-9 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Contact MaterialBrass
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole, Horizontal
Material Nylon
Housing Material Nylon
Body Material Polyamide (PA66), Nylon 6/6
Operating Temperature105°C
PackagingBulk
Published 1997
Feature For 0.080 Dia Test Plug
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type Tip Jack
Number of Positions 1
Color White
Gender Female
Orientation Right Angle
Contact Finish Gold
Number of Contacts 3
Housing Color White
Lead Length 3.302mm
ELV Compliant
Max Current Rating 4.75A
Plating Gold
Insulation Mating End Insulated
Plug/Mating Plug Diameter Standard Tip
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:1826 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.681800$7.6818
10$7.246981$72.46981
100$6.836775$683.6775
500$6.449787$3224.8935
1000$6.084705$6084.705

About 350180-9

The 350180-9 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features Test Probes TEST PROBE ASSEMBLY.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 350180-9, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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