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350180-2

350180-2

350180-2

TE Connectivity AMP Connectors

AMP - TE CONNECTIVITY - 350180-2 - TEST PROBE ASSEMBLY, PCB

SOT-23

350180-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Contact MaterialBrass
Mount Through Hole
Mounting Type Through Hole, Horizontal
Housing Material Nylon
Body Material Polyamide (PA66), Nylon 6/6
Operating Temperature105°C
PackagingBulk
Published 1997
Feature For 0.080 Dia Test Plug
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type Tip Jack
Color Red
Gender Female
Orientation Right Angle
Depth 5.54mm
Contact Finish Gold
Number of Contacts 3
ELV Compliant
Max Current Rating 4.75A
Number of Ports1
Insulation Mating End Insulated
Plug/Mating Plug Diameter Standard Tip
Length 14.25mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:820 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$6.41000$6.41
10$6.14100$61.41
25$5.60720$140.18
50$5.34000$267
100$5.07300$507.3
250$4.53900$1134.75
500$4.27200$2136

About 350180-2

The 350180-2 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features AMP - TE CONNECTIVITY - 350180-2 - TEST PROBE ASSEMBLY, PCB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 350180-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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