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322900

322900

322900

TE Connectivity AMP Connectors

322900 datasheet pdf and Terminals - Ring Connectors product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

322900 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialCopper
Mount Free Hanging
Mounting Type Free Hanging (In-Line), Right Angle
Material - Insulation Vinyl
PackagingBulk
Series Ampli-Bond
Published 1997
Feature Serrated Termination
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
ECCN Code EAR99
Color Red
HTS Code8536.90.40.00
Orientation Right Angle
Reach Compliance Code unknown
Contact Finish Tin
Wire Gauge2 AWG
ELV Non-Compliant
Wire/Cable Gauge 2 AWG
Terminal and Terminal Block Type RING TERMINAL
Insulation Diameter 0.505 (12.83mm)
Insulation Insulated
Terminal TypeCircular
Wire Cross Section 42.4 mm2
Stud/Tab Size 1/4 Stud
Length 9.42mm
Thickness 0.057 1.45mm
Width - Outer Edges 0.675 17.15mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:3585 items

About 322900

The 322900 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features 322900 datasheet pdf and Terminals - Ring Connectors product details from TE Connectivity AMP Connectors stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 322900, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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