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3-582119-0

3-582119-0

3-582119-0

TE Connectivity AMP Connectors

Conn Test Probe RCP 3 POS Solder RA Thru-Hole 1 Port

SOT-23

3-582119-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Contact MaterialBrass
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole, Horizontal
Material Nylon
Housing Material Nylon
Body Material Polyamide (PA66), Nylon 6/6
Operating Temperature105°C
PackagingBulk
Published 1997
Feature For 0.080 Dia Test Plug
Part StatusActive
Termination Solder
Type Tip Jack
Number of Positions 1
Max Operating Temperature85°C
Min Operating Temperature -55°C
Color Black
Gender Female
Orientation Right Angle
Depth 5.08mm
Contact Finish Gold
Number of Contacts 3
Housing Color Black
Lead Length 3.3mm
ELV Compliant
Max Current Rating 4.75A
Plating Gold
Number of Ports1
Insulation Mating End Insulated
Plug/Mating Plug Diameter Standard Tip
Length 11.68mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:2810 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 3-582119-0

The 3-582119-0 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Test Probe RCP 3 POS Solder RA Thru-Hole 1 Port.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3-582119-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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