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2199075-2

2199075-2

2199075-2

TE Connectivity AMP Connectors

TE CONNECTIVITY 2199075-2 Board-To-Board Connector, 4 Contacts, 1.6 mm, Surface Mount, 2 Rows

SOT-23

2199075-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Contact PlatingGold
Mount Surface Mount
Mounting Type Surface Mount
Number of Pins 4
Material Copper Alloy
Housing Material Thermoplastic
PackagingTape & Reel (TR)
Published 2013
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
Connector Type Compression Contact, Non-Gendered
Number of Positions 4
Number of Rows 2
Pitch 0.063 1.60mm
Contact Finish Gold
Number of Contacts 4
Housing Color Black
Row Spacing0.134 (3.40mm)
Sealable No
Contact Finish Thickness 3.94μin 0.10μm
Plating Thickness 200 nm
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
In-Stock:10322 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.67000$0.67
10$0.63100$6.31
25$0.57240$14.31
50$0.51300$25.65
100$0.49340$49.34
250$0.45392$113.48
500$0.43420$217.1

About 2199075-2

The 2199075-2 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features TE CONNECTIVITY 2199075-2 Board-To-Board Connector, 4 Contacts, 1.6 mm, Surface Mount, 2 Rows.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2199075-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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