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211991-6

211991-6

211991-6

TE Connectivity AMP Connectors

211991-6 datasheet pdf and Backplane Connectors - ARINC product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

211991-6 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 2 weeks ago)
Factory Lead Time 18 Weeks
Mount Panel
Insulation Material POLYPHENYLENE SULFIDE
Shell Material ALUMINUM ALLOY
PackagingBulk
Series 600
Published 2008
Feature Front Release
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Additional FeaturePOLARIZED
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts YES
Option GENERAL PURPOSE
Contact Gender FEMALE
Note Contacts Not Included
ELV Non-Compliant
Shell Size 2
Plating Aluminium
Sealable Yes
Preloaded No
Shell PlatingChromate
Class CodeC
Shell Style Receptacle
Cavity A 150
Cavity C 13C2
RoHS StatusNon-RoHS Compliant
In-Stock:64 items

Pricing & Ordering

QuantityUnit PriceExt. Price
25$273.69920$6842.48

About 211991-6

The 211991-6 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features 211991-6 datasheet pdf and Backplane Connectors - ARINC product details from TE Connectivity AMP Connectors stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 211991-6, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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