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207470-1

207470-1

207470-1

TE Connectivity AMP Connectors

CONN BACKSHELL 15P 90/180DEG BLK

SOT-23

207470-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Material Polypropylene
Body Material Thermoplastic
Mounting Option 2 SHELL SIZE 2
Published 1997
Series AMPLIMITE
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Connector
Number of Positions 15
Color Black
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Orientation Straight
Shielding Unshielded
Depth 43.18mm
ELV Compliant
Plating Plastic, Thermoplastic
Cable TypeRound
Accessory Type Hinged Backshell
Sealable No
Wire/Cable Diameter 8.13 mm
Cable Exit 90°, 180°
Cable Entry-Max 0.32 inch
Hardware Assembly Hardware, Strain Relief
Height 16mm
Length 27.38mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
In-Stock:574 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$15.066000$15.066
10$14.213208$142.13208
100$13.408686$1340.8686
500$12.649704$6324.852
1000$11.933683$11933.683

About 207470-1

The 207470-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BACKSHELL 15P 90/180DEG BLK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 207470-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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