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1969226-1

1969226-1

1969226-1

TE Connectivity AMP Connectors

1969226-1 datasheet pdf and Solid State Lighting Connectors product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

1969226-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 5 months ago)
Factory Lead Time 11 Weeks
Contact MaterialCopper Alloy
Mount Surface Mount
Mounting Type Surface Mount, Right Angle
Housing Material Liquid Crystal Polymer (LCP)
PackagingCut Tape (CT)
Published 2011
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle, Poke-In Wire
Number of Positions 2
Number of Rows 1
Pitch 0.157 4.00mm
Orientation Horizontal
Style Board to Cable/Wire
Current Rating4A
Contact Finish Tin
Housing Color White
Operating Supply Voltage250V
Wire Gauge18 AWG, 20 AWG, 22 AWG
Wire/Cable Gauge 22 AWG
Sealable No
RoHS StatusRoHS Compliant
In-Stock:23991 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 1969226-1

The 1969226-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features 1969226-1 datasheet pdf and Solid State Lighting Connectors product details from TE Connectivity AMP Connectors stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1969226-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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