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166722-2

166722-2

166722-2

TE Connectivity AMP Connectors

166722-2 datasheet pdf and Backplane Connectors - Contacts product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

166722-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 2 weeks ago)
Factory Lead Time 12 Weeks
Contact MaterialBronze
Mount Cable
PCB Mount Retention Without
PackagingBulk
Series AMPMODU
Published 2007
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Signal
Max Operating Temperature105°C
Min Operating Temperature -65°C
Orientation Straight
Contact Finish Gold
Wire Gauge20-24 AWG
ELV Compliant
Wire Gauge (Max) 24 AWG
Wire Gauge (Min) 20 AWG
Contact Current Rating3A
Contact Termination Crimp
Insulation Diameter 1.37 mm
Pin or Socket Socket
Make First / Break Last No
Contact Finish Thickness 50.0μin 1.27μm
Plating Thickness 1.27μm
RoHS StatusRoHS Compliant
Lead Free Not Applicable
In-Stock:17858 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 166722-2

The 166722-2 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features 166722-2 datasheet pdf and Backplane Connectors - Contacts product details from TE Connectivity AMP Connectors stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 166722-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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