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1418850-3

1418850-3

1418850-3

TE Connectivity AMP Connectors

Automotive Connectors Mcp 1.2 Cln Body-Sws

SOT-23

1418850-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Contact MaterialBronze
Contact PlatingTin
Mount Cable
PackagingTape & Reel (TR)
Published 2008
Series MCON
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature150°C
Min Operating Temperature -40°C
Gender Female
Orientation Straight
Shielding Unshielded
Contact Finish Silver
Wire Gauge15-17 AWG
ELV Compliant
Connector Support Type CONNECTOR ACCESSORY
Wire Gauge (Max) 17 AWG
Wire Gauge (Min) 15 AWG
Wire/Cable Gauge 17 AWG
Sealable Yes
Contact Termination Crimp
Insulation Diameter 2.4 mm
Pin or Socket Socket
Mating Tab Width 1.2mm
Length 16.5mm
Contact Finish Thickness 78.7μin 2.00μm
Tab Thickness 600μm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:25698 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.254313$0.254313
10$0.239918$2.39918
100$0.226338$22.6338
500$0.213526$106.763
1000$0.201440$201.44

About 1418850-3

The 1418850-3 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features Automotive Connectors Mcp 1.2 Cln Body-Sws.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1418850-3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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