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1339188-1

1339188-1

1339188-1

TE Connectivity AMP Connectors

INSERT 6P6C JACK TO IDC CONN

SOT-23

1339188-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialBronze
Mounting Type CABLE
Housing Material Polyphenylene
Exterior Housing Material Polyphenylene Oxide (PPO)
Exterior Contact Material Phosphor Bronze
Published 2006
Series SL 110Connect
Feature Hinged Dust Cover
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Connector Type TELECOM AND DATACOM CONNECTOR
Number of Positions 6
Additional FeatureRJ11C, RJ14C, RJ25C
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 6
Shielding Unshielded
Style Modular
Contact Gender FEMALE
Housing Color Brown
Empty Shell NO
ELV Compliant
Keyed No
Exterior Type (Adapter End) Modular Jack 6p6c (RJ11, RJ12, RJ14, RJ25)
Interior Type (Adapter End) IDC, Pressdown, Punchdown Block
Exterior Housing Color Almond
Exterior Contact Finish Gold
Plating Thickness 1.27μm
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
Ratings Cat3
In-Stock:2760 items

About 1339188-1

The 1339188-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features INSERT 6P6C JACK TO IDC CONN.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1339188-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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