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1337363-1

1337363-1

1337363-1

TE Connectivity AMP Connectors

1337363-1 datasheet pdf and Backplane Connectors - Housings product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

1337363-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Factory Lead Time 9 Weeks
Mounting Type Panel Mount
PackagingBulk
Published 1995
Feature Guide Pin
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Connector Type Housing for Non-Gendered Contacts
Number of Positions 10 (Power)
Color Black
Number of Rows 3
Gender Receptacle
Pitch 0.281 7.14mm
Number of Contacts 10
Housing Color Black
Row Spacing7.14 mm
Note Contacts Not Included
Connector Style Drawer
Sealable No
Mating Retention With
Connector Usage Receptacle
RoHS StatusRoHS Compliant
In-Stock:931 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.392000$1.392
10$1.313208$13.13208
100$1.238875$123.8875
500$1.168750$584.375
1000$1.102594$1102.594

About 1337363-1

The 1337363-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features 1337363-1 datasheet pdf and Backplane Connectors - Housings product details from TE Connectivity AMP Connectors stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1337363-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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