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1318697-6

1318697-6

1318697-6

TE Connectivity AMP Connectors

CONN SOCKET 8AWG CRIMP SILVER

SOT-23

1318697-6 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 22 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Mount Cable
Underplate Material Nickel
PackagingBulk
Published 2004
Series Dynamic D-5
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature221°C
Min Operating Temperature -67°C
Voltage - Rated 630V
Current Rating45A
Contact Finish Silver
Contact Gender Female
Operating Supply Voltage630V
Wire Gauge8 AWG
Connector Support Type CONNECTOR ACCESSORY
Wire/Cable Type Discrete
Wire/Cable Gauge 8 AWG
Sealable No
Contact Current Rating45A
Contact Termination Crimp
Insulation Diameter 7.7978 mm
Contact Retention With
Pin or Socket Socket
Length 23.4mm
Contact Finish Thickness 100.0μin 2.54μm
Plating Thickness 2.54μm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:2355 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.675636$2.675636
10$2.524185$25.24185
100$2.381307$238.1307
500$2.246516$1123.258
1000$2.119355$2119.355

About 1318697-6

The 1318697-6 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN SOCKET 8AWG CRIMP SILVER.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1318697-6, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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