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1-332070-3

1-332070-3

1-332070-3

TE Connectivity AMP Connectors

IC & Component Sockets SOCKET .034-.037 30AU

SOT-23

1-332070-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 19 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Contact MaterialBeryllium Copper
Mount Surface Mount
Mounting Hole Diameter 0.072 (1.83mm)
Operating Temperature-65°C~125°C
PackagingBulk
Published 2010
Series 4
Feature Open Bottom
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Orientation Straight
Depth 2.26mm
Contact Finish Gold
Number of Contacts 1
ELV Compliant
Max Current Rating 7.5A
Wire/Cable Type Discrete
Wire/Cable Gauge 19 AWG
Sealable No
Contact Current Rating7.5A
Circuit Application Power
Hole Diameter 1.8288 mm
Flange Diameter0.089 (2.26mm)
Tail Type No Tail
Accepts Pin Diameter 0.034 ~ 0.037 (0.86mm ~ 0.94mm)
Socket Depth 0.130 3.30mm
Length 3.6322mm
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 30μm
Length - Overall 0.143 3.63mm
PCB Thickness 3.18mm
RoHS StatusRoHS Compliant
In-Stock:17627 items

Pricing & Ordering

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About 1-332070-3

The 1-332070-3 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features IC & Component Sockets SOCKET .034-.037 30AU.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1-332070-3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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