5-1571551-2 datasheet pdf and Sockets for ICs, Transistors product details from TE Connectivity / AMP stock available on our website
SOT-23
5-1571551-2 Datasheet PDF
non-compliant
Technical Specifications
Parameter Name
Value
Type
Parameter
Contact Material
Copper
Contact Plating
Tin
Mount
Through Hole, Vertical
Package / Case
DIP
Insulation Material
Polyester
Housing Material
Thermoplastic
JESD-609 Code
e3
Pbfree Code
yes
Termination
Through Hole
ECCN Code
EAR99
Number of Positions
40
Max Operating Temperature
-105°C
Min Operating Temperature
-55°C
Number of Rows
2
Gender
Female
Voltage - Rated
1kV
Additional Feature
STANDARD: UL 94V-0
Pitch
2.54mm
Orientation
Straight
Terminal Pitch
2.54mm
Depth
17.78mm
Current Rating
3A
Row Spacing - Mating
15.24 mm
Number of Contacts
40
Lead Length
3.18mm
Contact Style
Screw
Contact Resistance
10mOhm
Insulation Resistance
5GOhm
ELV
Compliant
Device Socket Type
IC SOCKET
Length
50.8mm
Width
17.78mm
Radiation Hardening
No
RoHS Status
RoHS Compliant
Flammability Rating
UL94 V-0
Lead Free
Lead Free
In-Stock:3974 items
Pricing & Ordering
Quantity
Unit Price
Ext. Price
5-1571551-2 Product Details
Description: The TE Connectivity / AMP 5-1571551-2 is a 40-position dual in-line package (DIP) socket designed for integrated circuits (ICs) and transistors. It is made of a high-temperature thermoplastic material and features gold-plated contacts for reliable electrical connections. The socket is designed to fit standard 0.3 inch (7.62 mm) DIP packages and has a maximum current rating of 1.5A.
Features:
• 40-position dual in-line package (DIP) socket • High-temperature thermoplastic material • Gold-plated contacts for reliable electrical connections • Fits standard 0.3 inch (7.62 mm) DIP packages • Maximum current rating of 1.5A
Applications:
The TE Connectivity / AMP 5-1571551-2 socket is suitable for use in a variety of applications, including industrial, automotive, and consumer electronics. It is ideal for use with ICs and transistors, and can be used in applications such as power supplies, motor control, and signal conditioning.
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