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2013310-3

2013310-3

2013310-3

TE Connectivity / AMP

2013310-3 datasheet pdf and Memory Connectors - Inline Module Sockets product details from TE Connectivity / AMP stock available on our website

SOT-23

2013310-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 6 months ago)
Contact PlatingGold
Mount Surface Mount
Housing Material Thermoplastic
Termination SMD/SMT
ECCN Code EAR99
Max Operating Temperature185°C
Min Operating Temperature -67°C
Number of Rows 2
Voltage - Rated 1.5V
HTS Code8536.69.40.40
Pitch 609.6μm
Orientation Right Angle
Row Spacing - Mating 8.1788 mm
Number of Contacts 204
Housing Color Black
ELV Compliant
Memory TypeDDR, SDRAM
Sealable No
Circuit Application Power
Contact Rating (Current) 500mA
Current Rating (Max) 500mA
Height 9.2mm
Plating Thickness 760 nm
Stack Height 9.1948mm
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:3651 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 2013310-3

The 2013310-3 from TE Connectivity / AMP is a high-performance microcontroller designed for a wide range of embedded applications. This component features 2013310-3 datasheet pdf and Memory Connectors - Inline Module Sockets product details from TE Connectivity / AMP stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2013310-3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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