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2013297-3

2013297-3

2013297-3

TE Connectivity / AMP

2013297-3 datasheet pdf and Memory Connectors - Inline Module Sockets product details from TE Connectivity / AMP stock available on our website

SOT-23

2013297-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact PlatingGold
Mount Surface Mount
Insulation Material Thermoplastic
Housing Material Thermoplastic
Termination SMD/SMT
Number of Positions 204
Number of Rows 2
Voltage - Rated 1.5V
Pitch 600μm
Orientation Right Angle
Depth 26.5mm
Row Spacing - Mating 8.2 mm
Number of Contacts 204
Housing Color Black
ELV Compliant
Memory TypeDDR, SDRAM
Height 8mm
Length 75.9mm
Stack Height 8mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:4661 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 2013297-3

The 2013297-3 from TE Connectivity / AMP is a high-performance microcontroller designed for a wide range of embedded applications. This component features 2013297-3 datasheet pdf and Memory Connectors - Inline Module Sockets product details from TE Connectivity / AMP stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2013297-3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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