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2013290-2

2013290-2

2013290-2

TE Connectivity / AMP

2013290-2 datasheet pdf and Memory Connectors - Inline Module Sockets product details from TE Connectivity / AMP stock available on our website

SOT-23

2013290-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Contact PlatingGold
Mount Surface Mount
Insulation Material Thermoplastic
Housing Material Thermoplastic
Termination Solder
Number of Positions 204
Max Operating Temperature185°C
Min Operating Temperature -67°C
Number of Rows 2
Pitch 609.6μm
Orientation Right Angle
Depth 26.5mm
Row Spacing - Mating 8.1788 mm
Number of Contacts 204
Housing Color Black
ELV Compliant
Plating Gold
Memory TypeDDR, SDRAM
Sealable No
Circuit Application Power
Contact Rating (Current) 500mA
Current Rating (Max) 500mA
Length 71.5mm
Plating Thickness 254 nm
Stack Height 5.2mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:3009 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 2013290-2

The 2013290-2 from TE Connectivity / AMP is a high-performance microcontroller designed for a wide range of embedded applications. This component features 2013290-2 datasheet pdf and Memory Connectors - Inline Module Sockets product details from TE Connectivity / AMP stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2013290-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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