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RAY-101-12.5(100)

RAY-101-12.5(100)

RAY-101-12.5(100)

TE Connectivity Aerospace, Defense and Marine

RAY-101-12.5(100) datasheet pdf and Grounding Braid, Straps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

RAY-101-12.5(100) Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Factory Lead Time 12 Weeks
Material Copper, Tin Plated
Series RAYBRAID®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Tubular
Max Operating Temperature150°C
Min Operating Temperature -65°C
Plating Tin
DC Resistance (DCR) 3.23MOhm
Size, Supplied 0.492 12.50mm - Inner Dia
Wire Gauge - Ends 36 AWG
Number of Carriers 36
Length Digi-Spool? Continuous Spool
RoHS StatusRoHS Compliant
In-Stock:361 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$22.43000$22.43
5$18.88800$94.44
10$17.11700$171.17
25$15.93560$398.39
50$15.34360$767.18
100$12.75300$1275.3

About RAY-101-12.5(100)

The RAY-101-12.5(100) from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features RAY-101-12.5(100) datasheet pdf and Grounding Braid, Straps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RAY-101-12.5(100), including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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