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B07D111BC4-0006

B07D111BC4-0006

B07D111BC4-0006

TE Connectivity Aerospace, Defense and Marine

General Purpose Relays MS27247-1

SOT-23

B07D111BC4-0006 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 26 Weeks
Contact MaterialSilver Cadmium Oxide (AgCdO)
Mount Chassis Mount, Socket
Mounting Type Chassis Mount
Package / Case 300
Operating Temperature-70°C~125°C
PackagingBulk
Published 2000
Series Military, MS27247, 07, CII
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination PC Pin, Socket
ECCN Code EAR99
Current Rating10A
Termination Style PC Pin
ELV Non-Compliant
Throw Configuration DPDT
Contact FormDPDT (2 Form C)
Relay Type General Purpose
Coil Resistance300Ohm
Operate Time10ms
Coil Voltage 28VDC
Coil TypeNon Latching
Switching Voltage115VAC 28VDC -Max
Coil Current93.3mA
Must Operate Voltage 13VDC
Coil Power 2.341W
Must Release Voltage 1.5VDC
Coil Voltage (DC) 26.5V
Seal Rating Sealed - Hermetically
RoHS StatusNon-RoHS Compliant
In-Stock:58 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$464.44000$464.44
10$447.84900$4478.49

About B07D111BC4-0006

The B07D111BC4-0006 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features General Purpose Relays MS27247-1.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B07D111BC4-0006, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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