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403A123-4/42-0

403A123-4/42-0

403A123-4/42-0

TE Connectivity Aerospace, Defense and Marine

403A123-4/42-0 datasheet pdf and Heat Shrink Boots, Caps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

403A123-4/42-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Package / Case Molded
Material Polyolefin (PO), Flexible
Series Thermofit 403A1
Published 2009
Feature Adhesive Coating, Flame Retardant
Part StatusActive
Type Boot, Transition - Breakout, 3:1
Color Black
Shell Size - Insert 23
ELV Compliant
Large Diameter Recovered0.690 (17.53mm)
Large Diameter Supplied 1.250 (31.75mm)
Small Diameter Recovered 0.180 (4.57mm)
Small Diameter Supplied 0.550 (13.97mm)
Large Recovered Length 1.480 37.59mm
Total Length Recovered 3.500 88.90mm
Small Recovered Length 0.800 20.32mm
RoHS StatusRoHS Compliant
In-Stock:81 items

Pricing & Ordering

QuantityUnit PriceExt. Price
25$112.45240$2811.31

About 403A123-4/42-0

The 403A123-4/42-0 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features 403A123-4/42-0 datasheet pdf and Heat Shrink Boots, Caps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 403A123-4/42-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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