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3SBH1141A2

3SBH1141A2

3SBH1141A2

TE Connectivity Aerospace, Defense and Marine

Low Signal Relays - PCB 3SBH1141A2 = M39016/14-001L

SOT-23

3SBH1141A2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Mount Chassis Mount, Flanges
Mounting Type Chassis Mount
Operating Temperature-65°C~125°C
PackagingBulk
Published 2001
Series 3SBH, CII
Part StatusActive
Termination Solder
Max Operating Temperature125°C
Min Operating Temperature -65°C
Termination Style Solder Hook
ELV Non-Compliant
Max Current Rating 2A
Throw Configuration 4PDT
Max Voltage Rating (DC) 28V
Contact Form4PDT (4 Form C)
Relay Type General Purpose
Coil Resistance720Ohms
Operate Time4ms
Coil Voltage 26.5VDC
Coil TypeNon Latching
Switching Voltage28VDC - Nom
Coil Current36.8mA
Release Time4ms
Must Operate Voltage 13.5VDC
Contact Rating (Current) 2A
Coil Power 975mW
Must Release Voltage 1.5VDC
Coil Voltage (DC) 26.5V
Seal Rating Sealed - Hermetically
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
In-Stock:55 items

Pricing & Ordering

QuantityUnit PriceExt. Price
8$497.30750$3978.46

About 3SBH1141A2

The 3SBH1141A2 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features Low Signal Relays - PCB 3SBH1141A2 = M39016/14-001L.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3SBH1141A2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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