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382W042-25-0

382W042-25-0

382W042-25-0

TE Connectivity Aerospace, Defense and Marine

382W042-25-0 datasheet pdf and Heat Shrink Boots, Caps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

382W042-25-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Material Elastomer, Semi-Rigid
Series Thermofit 382W0
Published 2007
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Boot, Transition - Breakout, 2:1 (Y)
Color Black
Shell Size - Insert 42
Large Diameter Recovered0.310 (7.87mm)
Large Diameter Supplied 0.790 (20.07mm)
Small Diameter Recovered 0.157 (3.99mm)
Small Diameter Supplied 0.350 (8.89mm)
Large Recovered Length 1.180 29.97mm
Small Recovered Length 1.260 32.00mm
RoHS StatusRoHS Compliant
In-Stock:163 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$61.830000$61.83
10$58.330189$583.30189
100$55.028480$5502.848
500$51.913660$25956.83
1000$48.975151$48975.151

About 382W042-25-0

The 382W042-25-0 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features 382W042-25-0 datasheet pdf and Heat Shrink Boots, Caps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 382W042-25-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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