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205165-4

205165-4

205165-4

TE Connectivity Aerospace, Defense and Marine

D-Sub High Density Connectors RECEPT ASSY,25 POSN ,AMPLIMITE

SOT-23

205165-4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Contact MaterialNOT SPECIFIED
Mounting Type Free Hanging (In-Line)
Insulation Material GLASS FILLED POLYESTER
Shell Material, Finish Steel, Tin Plated
Operating Temperature-50°C~125°C
PackagingBulk
Published 2015
Series AMPLIMITE 109
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Receptacle for Female Contacts
Number of Positions 25
Number of Rows 2
Contact Finish - Mating NOT SPECIFIED
MIL Conformance YES
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Signal
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 25
Empty Shell NO
Note Contacts Not Included
Flange Feature Housing/Shell (Unthreaded)
Connector Style D-Sub
Shell Size, Connector Layout3 DB B
Shell Finish Thickness 400μin 10.16μm
RoHS StatusRoHS Compliant
In-Stock:848 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 205165-4

The 205165-4 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features D-Sub High Density Connectors RECEPT ASSY,25 POSN ,AMPLIMITE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 205165-4, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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