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202D932-4-60-0-CS6121

202D932-4-60-0-CS6121

202D932-4-60-0-CS6121

TE Connectivity Aerospace, Defense and Marine

202D932-4-60-0-CS6121 datasheet pdf and Heat Shrink Boots, Caps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

202D932-4-60-0-CS6121 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Material Polyolefin (PO), Flexible, Irradiated
Series Thermofit 202D9
Published 1998
Feature Flame Retardant, Fluid Resistant, Heat Resistant, Lip
Part StatusActive
Type Boot
Color Black, White
Shell Size - Insert 32
Large Diameter Recovered0.752 (19.10mm)
Large Diameter Supplied 1.030 (26.16mm)
Small Diameter Recovered 0.102 (2.59mm)
Small Diameter Supplied 0.300 (7.62mm)
Total Length Recovered 2.921 74.19mm
Small Recovered Length 1.770 44.96mm
RoHS StatusRoHS Compliant
In-Stock:512 items

Pricing & Ordering

QuantityUnit PriceExt. Price
93$17.16000$1595.88

About 202D932-4-60-0-CS6121

The 202D932-4-60-0-CS6121 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features 202D932-4-60-0-CS6121 datasheet pdf and Heat Shrink Boots, Caps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 202D932-4-60-0-CS6121, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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