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202D296-4-61-0

202D296-4-61-0

202D296-4-61-0

TE Connectivity Aerospace, Defense and Marine

202D296-4-61-0 datasheet pdf and Heat Shrink Boots, Caps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

202D296-4-61-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Material Polyolefin (PO), Flexible, Irradiated
Series Thermofit 202D2
Published 2000
Feature Drain Holes, Flame Retardant, Fluid Resistant, Heat Resistant, Lip
Part StatusActive
Type Boot
Color Black, Red
Shell Size - Insert 96
Large Diameter Recovered2.350 (59.69mm)
Large Diameter Supplied 2.728 (69.29mm)
Small Diameter Recovered 0.772 (19.61mm)
Small Diameter Supplied 2.728 (69.29mm)
Large Recovered Length 0.630 16.00mm
Total Length Recovered 8.000 203.20mm
Small Recovered Length 5.642 143.31mm
RoHS StatusRoHS Compliant
In-Stock:221 items

Pricing & Ordering

QuantityUnit PriceExt. Price
41$40.53244$1661.83004

About 202D296-4-61-0

The 202D296-4-61-0 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features 202D296-4-61-0 datasheet pdf and Heat Shrink Boots, Caps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 202D296-4-61-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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