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1958078-1

1958078-1

1958078-1

TE Connectivity Aerospace, Defense and Marine

1958078-1 datasheet pdf and Terminals - Ring Connectors product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

1958078-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Contact MaterialBrass
Mount Sealed
Mounting Type Free Hanging (In-Line)
PackagingBulk
Series Copalum
Published 2016
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Contact Finish Nickel
Wire Gauge4/0 AWG
Insulation Non-Insulated
Terminal TypeFlat Sided, 2 Holes, Tubular (Battery Lugs)
Stud/Tab Size 3/8 Stud
Thickness 0.177 4.50mm
Length - Overall 3.720 94.49mm
Width - Outer Edges 1.000 25.40mm
RoHS StatusRoHS Compliant
In-Stock:51 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$393.46000$393.46
500$389.5254$194762.7
1000$385.5908$385590.8
1500$381.6562$572484.3
2000$377.7216$755443.2
2500$373.787$934467.5

About 1958078-1

The 1958078-1 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features 1958078-1 datasheet pdf and Terminals - Ring Connectors product details from TE Connectivity Aerospace, Defense and Marine stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1958078-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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