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166296-1

166296-1

166296-1

TE Connectivity Aerospace, Defense and Marine

166296-1 datasheet pdf and Contacts - Multi Purpose product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

166296-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialBrass
Contact PlatingGold
Mount Cable
PackagingBulk
Series Multimate XI
Published 2008
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
ECCN Code EAR99
Type Stamped
Gender Male
HTS Code8536.90.40.00
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Orientation Straight
Shielding Unshielded
Wire Gauge20-24 AWG
ELV Compliant
Contact Termination Crimp
Test Current 3A
Insulation Diameter 1.6 mm
Contact Design LOOSE
Pin or Socket Pin
Assembly Item Name CONTACT
Wire Size (Max) 20 AWG
Finish Thickness 31
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Not Applicable
In-Stock:2542 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 166296-1

The 166296-1 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features 166296-1 datasheet pdf and Contacts - Multi Purpose product details from TE Connectivity Aerospace, Defense and Marine stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 166296-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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