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1-448139-4

1-448139-4

1-448139-4

TE Connectivity Aerospace, Defense and Marine

1-448139-4 datasheet pdf and Backplane Connectors - Contacts product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

1-448139-4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 4 months ago)
Factory Lead Time 4 Weeks
Contact PlatingGold
Mount Cable
Material COPPER ALLOY
PackagingBulk
Series ARINC 600
Published 2006
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Type Signal
Gender Male
Additional FeatureUNDERPLATING THICKNESS 50
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Orientation Straight
Shielding Unshielded
Contact Style Pin
ELV Compliant
Contact Termination Solder, PCB
Assembly Item Name CONTACT
Length 32.13mm
Contact Finish Thickness 50.0μin 1.27μm
RoHS StatusRoHS Compliant
In-Stock:715 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 1-448139-4

The 1-448139-4 from TE Connectivity Aerospace, Defense and Marine is a high-performance microcontroller designed for a wide range of embedded applications. This component features 1-448139-4 datasheet pdf and Backplane Connectors - Contacts product details from TE Connectivity Aerospace, Defense and Marine stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1-448139-4, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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