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8-32951-1

8-32951-1

8-32951-1

TE Connectivity

8-32951-1 datasheet pdf and Terminals - Ring Connectors product details from TE Connectivity stock available on our website

SOT-23

8-32951-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Contact MaterialCopper
Contact PlatingTin
Mount Free Hanging
Insulation Material Vinyl
PackagingBulk
Published 2011
Pbfree Code yes
Termination Circular
ECCN Code EAR99
Color Red
HTS Code8536.90.40.00
Voltage - Rated AC 600V
Wire Gauge (Max) 16 AWG
Wire Gauge (Min) 22 AWG
Terminal and Terminal Block Type RING TERMINAL
Insulation Diameter 3.175 mm
Insulation Insulated
Wire/Cable Diameter 3.18 mm
Insulated Wire Support Yes
Heavy Duty No
Stud Diameter 4.17 mm
Number of Holes 1
Stud Size M4
Length 21.7424mm
Thickness 787.4μm
Material Thickness790μm
Tongue Thickness 840μm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:16808 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.254608$0.254608
10$0.240196$2.40196
100$0.226600$22.66
500$0.213774$106.887
1000$0.201673$201.673

About 8-32951-1

The 8-32951-1 from TE Connectivity is a high-performance microcontroller designed for a wide range of embedded applications. This component features 8-32951-1 datasheet pdf and Terminals - Ring Connectors product details from TE Connectivity stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 8-32951-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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