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390263-1

390263-1

390263-1

TE Connectivity

390263-1 datasheet pdf and Terminals - PC Pin Receptacles, Socket Connectors product details from TE Connectivity stock available on our website

SOT-23

390263-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialPHOSPHOR BRONZE
Housing Material POLYETHYLENE
ECCN (US) EAR99
Terminal Pitch (mm) 2.54
Termination Method Solder
Body Orientation Straight
Maximum Current Rating (A) 1/Contact
Maximum Voltage Rating 250VAC
Maximum Contact Resistance (mOhm) 20
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Product Depth (mm) 17.7
Mounting Through Hole
Manufacturer TE Connectivity
PackagingTube
JESD-609 Code e0
Part StatusObsolete
ECCN Code EAR99
Type DIP Socket
Number of Rows 2
Gender SKT
HTS Code8536.69.40.40
Reach Compliance Code unknown
Number of Contacts 28
Contact Finish Termination TIN LEAD
Device Socket Type IC SOCKET
Device Type Used On DIP28
Product Length (mm) 35.56
Product Height (mm) 5.1
RoHS StatusRoHS Compliant
In-Stock:1083 items

About 390263-1

The 390263-1 from TE Connectivity is a high-performance microcontroller designed for a wide range of embedded applications. This component features 390263-1 datasheet pdf and Terminals - PC Pin Receptacles, Socket Connectors product details from TE Connectivity stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 390263-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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