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1532274-3

1532274-3

1532274-3

TE Connectivity

1532274-3 datasheet pdf and Unclassified product details from TE Connectivity stock available on our website

SOT-23

1532274-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialNOT SPECIFIED
Mounting Type BOARD
Insulation Material LIQUID CRYSTAL POLYMER
Shell Material ALUMINUM ALLOY
JESD-609 Code e0
Connector Type D MICROMINIATURE CONNECTOR
Additional FeatureSTANDARD: MIL-DTL-83513/25
Contact Finish - Mating NOT SPECIFIED
MIL Conformance YES
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 9
Reach Compliance Code compliant
Shell Finish NICKEL
Contact Gender FEMALE
Empty Shell NO
Body/Shell Style RECEPTACLE
Shell Size A
Termination Type SOLDER
Contact Finish Termination Tin/Lead (Sn/Pb)
RoHS StatusRoHS Compliant
In-Stock:118 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$102.13000$102.13
500$101.1087$50554.35
1000$100.0874$100087.4
1500$99.0661$148599.15
2000$98.0448$196089.6
2500$97.0235$242558.75

About 1532274-3

The 1532274-3 from TE Connectivity is a high-performance microcontroller designed for a wide range of embedded applications. This component features 1532274-3 datasheet pdf and Unclassified product details from TE Connectivity stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1532274-3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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