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1355719-2

1355719-2

1355719-2

TE Connectivity

1355719-2 datasheet pdf and Rectangular Connectors - Contacts product details from TE Connectivity stock available on our website

SOT-23

1355719-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 6 days ago)
Factory Lead Time 13 Weeks
Contact PlatingGold
Mount Cable
PackagingTape & Reel (TR)
Published 2011
Part StatusActive
Termination Crimp
ECCN Code EAR99
Connector Type Connector, Power
Max Operating Temperature140°C
Min Operating Temperature -40°C
HTS Code8536.90.40.00
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Contact Gender MALE
ELV Compliant
Connector Support Type CONNECTOR ACCESSORY
Wire Gauge (Max) 26 AWG
Wire Gauge (Min) 22 AWG
Sealable No
Insulation Diameter 1.1938 mm
Rated Current 2A
Assembly Item Name CONTACT
Mating Tab Width 640μm
Cable Entry-Max 0.047 inch
Cable Entry-Min 0.035 inch
Tab Thickness 640μm
RoHS StatusRoHS Compliant
Lead Free Not Applicable
In-Stock:34164 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 1355719-2

The 1355719-2 from TE Connectivity is a high-performance microcontroller designed for a wide range of embedded applications. This component features 1355719-2 datasheet pdf and Rectangular Connectors - Contacts product details from TE Connectivity stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1355719-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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