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B82498F3680J000

B82498F3680J000

B82498F3680J000

TDK Electronics Inc.

Inductor Chip Molded Wirewound 68nH 5% 200MHz 60Q-Factor Ceramic 500mA 180mOhm DCR 0805 Automotive Blister T/R

SOT-23

B82498F3680J000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case Nonstandard
Supplier Device Package 0805 (2012 Metric)
Material - Core Ceramic
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Published 2011
Series SIMID
Size / Dimension 0.091Lx0.067W 2.30mmx1.70mm
Tolerance ±5%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Wirewound
Current Rating (Amps) 500mA
Shielding Unshielded
Inductance 68nH
DC Resistance (DCR) 180mOhm Max
Frequency - Self Resonant 1.6GHz
Q @ Freq 60 @ 500MHz
Inductance Frequency - Test 200MHz
Height Seated (Max) 0.055 1.40mm
RoHS StatusROHS3 Compliant
In-Stock:9840 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.387939$0.387939
10$0.365980$3.6598
100$0.345264$34.5264
500$0.325721$162.8605
1000$0.307284$307.284

About B82498F3680J000

The B82498F3680J000 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Inductor Chip Molded Wirewound 68nH 5% 200MHz 60Q-Factor Ceramic 500mA 180mOhm DCR 0805 Automotive Blister T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B82498F3680J000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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