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B82498F3569K000

B82498F3569K000

B82498F3569K000

TDK Electronics Inc.

Inductor Chip Molded Wirewound 5.6nH 10% 250MHz 50Q-Factor Ceramic 900mA 40mOhm DCR 0805 Blister T/R

SOT-23

B82498F3569K000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case Nonstandard
Supplier Device Package 0805 (2012 Metric)
Material - Core Ceramic
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Published 2012
Series SIMID
Size / Dimension 0.091Lx0.067W 2.30mmx1.70mm
Tolerance ±10%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Wirewound
Current Rating (Amps) 900mA
Shielding Unshielded
Inductance 5.6nH
DC Resistance (DCR) 40mOhm Max
Frequency - Self Resonant 7GHz
Q @ Freq 50 @ 1GHz
Inductance Frequency - Test 250MHz
Height Seated (Max) 0.055 1.40mm
RoHS StatusROHS3 Compliant
In-Stock:10240 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.77000$0.77
500$0.7623$381.15
1000$0.7546$754.6
1500$0.7469$1120.35
2000$0.7392$1478.4
2500$0.7315$1828.75

About B82498F3569K000

The B82498F3569K000 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Inductor Chip Molded Wirewound 5.6nH 10% 250MHz 50Q-Factor Ceramic 900mA 40mOhm DCR 0805 Blister T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B82498F3569K000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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