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B82422H1682K000

B82422H1682K000

B82422H1682K000

TDK Electronics Inc.

EPCOS B82422H1682K000 Surface Mount High Frequency Inductor, B82422H Series, 6.8 H, 570 mA, 1210 [3225 Metric]

SOT-23

B82422H1682K000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 2-SMD, J-Lead
Supplier Device Package 1210 (3225 Metric)
Material - Core Ferrite
Operating Temperature-55°C~150°C
PackagingTape & Reel (TR)
Published 2011
Series SIMID
Size / Dimension 0.126Lx0.098W 3.20mmx2.50mm
Tolerance ±10%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Wirewound
Current Rating (Amps) 570mA
Shielding Unshielded
Inductance 6.8μH
DC Resistance (DCR) 350mOhm Max
Frequency - Self Resonant 35MHz
Q @ Freq 10 @ 2.52MHz
Inductance Frequency - Test 7.96MHz
Height Seated (Max) 0.083 2.10mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:8469 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.74000$0.74
500$0.7326$366.3
1000$0.7252$725.2
1500$0.7178$1076.7
2000$0.7104$1420.8
2500$0.703$1757.5

About B82422H1682K000

The B82422H1682K000 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features EPCOS B82422H1682K000 Surface Mount High Frequency Inductor, B82422H Series, 6.8 H, 570 mA, 1210 [3225 Metric].

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B82422H1682K000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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