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B82422A3270J100

B82422A3270J100

B82422A3270J100

TDK Electronics Inc.

Inductor Chip Molded Wirewound 27nH 5% 10MHz 23Q-Factor Ceramic 600mA 140mOhm DCR 1210 Automotive Blister T/R

SOT-23

B82422A3270J100 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 2-SMD, J-Lead
Supplier Device Package 1210 (3225 Metric)
Material - Core Ceramic
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Published 2012
Series SIMID
Size / Dimension 0.126Lx0.098W 3.20mmx2.50mm
Tolerance ±5%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Wirewound
Current Rating (Amps) 600mA
Shielding Unshielded
Inductance 27nH
DC Resistance (DCR) 140mOhm Max
Frequency - Self Resonant 1.85GHz
Q @ Freq 23 @ 50MHz
Inductance Frequency - Test 10MHz
Height Seated (Max) 0.083 2.10mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:26585 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About B82422A3270J100

The B82422A3270J100 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Inductor Chip Molded Wirewound 27nH 5% 10MHz 23Q-Factor Ceramic 600mA 140mOhm DCR 1210 Automotive Blister T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B82422A3270J100, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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