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B82144F2274J000

B82144F2274J000

B82144F2274J000

TDK Electronics Inc.

B82144F2274J000 datasheet pdf and Fixed Inductors product details from TDK Electronics Inc. stock available on our website

SOT-23

B82144F2274J000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Through Hole
Package / Case Axial
Supplier Device Package Axial
Material - Core Ferrite
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Series LBC
Published 2015
Size / Dimension 0.256Diax0.362L 6.50mmx9.20mm
Tolerance ±5%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Wirewound
Current Rating (Amps) 800mA
Shielding Unshielded
Inductance 270μH
DC Resistance (DCR) 1.2Ohm Max
Frequency - Self Resonant 3.2MHz
Q @ Freq 40 @ 79.6kHz
Inductance Frequency - Test 100kHz
Current - Saturation 580mA
RoHS StatusROHS3 Compliant
In-Stock:10062 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.494360$0.49436
10$0.466377$4.66377
100$0.439978$43.9978
500$0.415074$207.537
1000$0.391580$391.58

About B82144F2274J000

The B82144F2274J000 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features B82144F2274J000 datasheet pdf and Fixed Inductors product details from TDK Electronics Inc. stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B82144F2274J000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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