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B65819P0000R087

B65819P0000R087

B65819P0000R087

TDK Electronics Inc.

Ferrite RM7 Core (11.3x17.2mm) N87 AL=3300nH 30% -20% Ungapped

SOT-23

B65819P0000R087 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 24 Weeks
Supplier Device Package RM 7 LP
Material N87
Series B65819P
Tolerance -20% +30%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Finish Uncoated
Core Type RM
Gap Ungapped
Effective Area (Ae) mm2 45.3
Effective Length (le) mm 23.5
Effective Magnetic Volume (Ve) mm3 1060
Core Factor (ΣI/A) mm1 0.52
Initial Permeability (μi) 2200
Minimum Core Cross Section (Amin) mm2 39.6
Inductance Factor (Al) 3.3μH
Effective Permeability (μe) 1360
Height 4.90mm
Length 20.30mm
RoHS StatusROHS3 Compliant
In-Stock:5940 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.443582$0.443582
10$0.418474$4.18474
100$0.394787$39.4787
500$0.372440$186.22
1000$0.351359$351.359

About B65819P0000R087

The B65819P0000R087 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Ferrite RM7 Core (11.3x17.2mm) N87 AL=3300nH 30% -20% Ungapped.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B65819P0000R087, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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