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B65819J0000R097

B65819J0000R097

B65819J0000R097

TDK Electronics Inc.

Ferrite RM7 Core (11.3x17.2mm) N97 AL=2700nH 30% -20% Ungapped

SOT-23

B65819J0000R097 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 24 Weeks
Supplier Device Package RM 7
Material N97
Published 2014
Series B65819
Tolerance -20% +30%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Finish Uncoated
Core Type RM
Gap Ungapped
Effective Area (Ae) mm2 43
Effective Length (le) mm 30.4
Effective Magnetic Volume (Ve) mm3 1310
Core Factor (ΣI/A) mm1 0.7
Initial Permeability (μi) 2300
Minimum Core Cross Section (Amin) mm2 39
Inductance Factor (Al) 2.7μH
Effective Permeability (μe) 1520
Height 6.75mm
Length 20.30mm
RoHS StatusROHS3 Compliant
In-Stock:3596 items

Pricing & Ordering

QuantityUnit PriceExt. Price
750$1.46624$1099.68

About B65819J0000R097

The B65819J0000R097 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Ferrite RM7 Core (11.3x17.2mm) N97 AL=2700nH 30% -20% Ungapped.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B65819J0000R097, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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