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B65807J0000R608

B65807J0000R608

B65807J0000R608

TDK Electronics Inc.

RM6-PC200

SOT-23

B65807J0000R608 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 24 Weeks
Supplier Device Package RM 6
Material PC200
Published 2017
Series B65807
Tolerance -20% +30%
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Finish Uncoated
Core Type RM
Gap Ungapped
Effective Area (Ae) mm2 36.6
Effective Length (le) mm 28.6
Effective Magnetic Volume (Ve) mm3 1050
Core Factor (ΣI/A) mm1 0.78
Initial Permeability (μi) 800
Minimum Core Cross Section (Amin) mm2 31
Effective Permeability (μe) 680
Height 12.50mm
Length 17.90mm
Width 8.20mm
RoHS StatusROHS3 Compliant
In-Stock:1603 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.72000$2.72
10$2.34500$23.45
25$1.78240$44.56
50$1.68840$84.42
100$1.50080$150.08
250$1.40700$351.75
500$1.31320$656.6

About B65807J0000R608

The B65807J0000R608 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features RM6-PC200.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B65807J0000R608, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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