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B43866A2227M

B43866A2227M

B43866A2227M

TDK Electronics Inc.

CAP ALUM 220UF 20% 200V RADIAL

SOT-23

B43866A2227M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Mounting Type Through Hole
Package / Case Radial, Can
Surface MountNO
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
Operating Temperature-40°C~125°C
PackagingBulk
Series B43866
Size / Dimension 0.709Dia 18.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
Voltage - Rated 200V
Additional FeatureSTANDARD: IEC60384-4
Capacitance 220μF
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 1.5Ohm @ 120Hz
Lead Spacing0.295 7.50mm
Rated (DC) Voltage (URdc) 200V
Lifetime @ Temp 2000 Hrs @ 125°C
Leakage Current 1.335mA
Polarization Polar
Tan Delta 0.2
Ripple Current @ High Frequency 825mA @ 100kHz
Height Seated (Max) 1.417 36.00mm
RoHS StatusROHS3 Compliant
In-Stock:1576 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About B43866A2227M

The B43866A2227M from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 220UF 20% 200V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B43866A2227M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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