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B43540B2827M

B43540B2827M

B43540B2827M

TDK Electronics Inc.

CAP ALUM 820UF 20% 200V SNAP

SOT-23

B43540B2827M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mounting Type Through Hole
Package / Case Radial, Can - Snap-In
Surface MountNO
Dielectric MaterialALUMINUM (WET)
Operating Temperature-40°C~85°C
PackagingBulk
Series B43540
Size / Dimension 1.181Dia 30.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
Voltage - Rated 200V
Capacitance 820μF
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 100mOhm @ 100Hz
Lead Spacing0.394 10.00mm
Rated (DC) Voltage (URdc) 200V
Lifetime @ Temp 10000 Hrs @ 85°C
Leakage Current 1.345257mA
Polarization Polar
Impedance130mOhm
Ripple Current @ Low Frequency 2.97A @ 100Hz
Diameter 30mm
Height Seated (Max) 1.457 37.00mm
Length 35mm
RoHS StatusROHS3 Compliant
In-Stock:4503 items

Pricing & Ordering

QuantityUnit PriceExt. Price
320$3.58863$1148.3616

About B43540B2827M

The B43540B2827M from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 820UF 20% 200V SNAP.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B43540B2827M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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